Epiform® - Coating Liquid for Magnetic Bonding
These one-part Epiform adhesives have strong magnetic bonding and are resins used for motors. Many grades are available, with high adhesive strength, impact resistance, and high heat resistance.
SOMATECT KZ
SOMATECT KZ Series are heat-curable resins for semiconductor sealing. Various resins for different applications such as glob-top resins, underfill resins and CSP reinforcing resins, etc. are available.
SOMAKOTE® IR
SOMAKOTE IR series are heat-curable SMD adhesives. Various adhesives are available from high adhesion to low temperature cure, pressure-syringe dispensing, screen printing use, etc.